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GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553

　　The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity. It features advanced Radio Frequency Integrated Circuits (RFIC), enhanced security mechanisms, generous storage capacity, and a wide range of universal interfaces. Leveraging a mature process platform and cost-effective optimization, it consistently delivers solutions for market applications demanding efficient wireless capabilities. The new product lineup offers eight different models. GigaDevice is now accepting requests for samples and evaluation boards in two compact package options: QFN40 and QFN32. These products are scheduled for mass production and will be available for delivery starting in December 2023.　　With its excellent edge processing and connectivity features, GD32VW553 applies to various wireless application scenarios, including smart home appliances, smart home systems, industrial Internet, and communication gateways. This series of MCUs is also well suited for scenarios with budget constraints, making it an ideal choice for office equipment, payment terminals, and various IoT products.　　Eric Jin, GigaDevice's Product Marketing Director, stated, "The new GD32VW553 series, with its optimized RISC-V open-source instruction set architecture, incorporates the microcontroller with advanced Combo Wireless connection protocols. This addresses the increasing connectivity demands in the thriving home appliances and emerging AIoT market, achieving a balance between processing performance, solution design, and material costs. With an ongoing expansion of GD32 RF development platform, it adeptly addresses wireless design challenges in hi-density and intricate environments, presenting developers with a secure, dependable, energy-efficient, and efficient connectivity experience."　　The GD32VW553 series RISC-V core Combo Wireless MCU　　Leading RF computing performance　　To fulfill the requirements of real-time processing and efficient communication, the GD32VW553 series MCU incorporates a new open-source instruction set architecture with the RISC-V processor core, boasting a maximum clock frequency of 160 MHz. Additionally, it incorporates advanced DSP hardware acceleration, a double-precision floating-point unit (FPU), instruction expansion interfaces, and various other resources. Through excellent microarchitecture design, this combination results in outstanding energy efficiency, while providing flexibility for scalability.　　The integrated 2.4 GHz Wi-Fi 6 RF module follows the IEEE 802.11ax standard and is backward compatible with the IEEE 802.11b/g/n standard, ensuring its suitability for different network environments. It supports Orthogonal Frequency Division Multiple Access (OFDMA) enabling multiple devices to share channel resources, resulting in 60% higher data transmission rate compared to Wi-Fi 4. Additionally, it offers support for Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling multiple devices to work simultaneously without interfering with each other, thus achieving high-efficiency and low-latency communication in multi-device high-density access scenarios.　　The integrated Bluetooth LE 5.2 RF module extends the communication distance, increases throughput, enhances security, and saves power following the latest Bluetooth specifications. It provides 2 Mbps high-speed data mode and multiple rates of 125K/500Kbps to effectively reduce transmission time and improve sensitivity. It facilitates the establishment and configuration of stable and high-speed wireless networks even in the case of multiple devices and complex environments.　　The new Combo Wireless MCU offers advanced baseband and RF performance with a variety of additional features. It supports the wireless coexistence protocol based on the Package Traffic Arbitration (PTA) mechanism, significantly reducing same-frequency interference caused by Wi-Fi and Bluetooth; thereby enhancing the stability of signal reception. Additionally, it is equipped with Automatic Gain Control (AGC) in a high dynamic range to effectively enhance signal quality. Thanks to the Target Wake Time (TWT) of Wi-Fi 6, GD32VW553 can flexibly schedule the sleep and wake-up time, improving energy-saving efficiency and meeting the access requirements of wireless devices with low power consumption and long battery life.　　High integration and security　　The new GD32VW553 series integrates up to 4MB Flash, 320KB SRAM, and 32KB configurable Instruction Cache (I-Cache) to greatly improve CPU processing efficiency. The GD32VW553, delivering excellent wireless performance, is also equipped with rich universal wired interfaces, including three U(S)ART, two I2C, one SPI, one four-wire QSPI, and up to 29 programmable GPIO pins. Its built-in components include two 32-bit general-purpose timers, two 16-bit general-purpose timers, four 16-bit basic timers, one PWM advanced timer, and one 12-bit ADC. The power supply voltage ranges from 1.8 V to 3.6 V and it offers high temperature up to 105℃ to meet the application scenarios such as industrial control interconnection, lighting equipment, and socket panels.　　The GD32VW553 series also provides multiple security features to streamline secure connection and management of high-performance wireless devices. It supports the Wi-Fi Protected Access (WPA) security feature, incorporating new WPA3 encryption technologies for both personal and corporate networks. The hardware encryption and decryption engine support DES, triple DES, AES, and Hash algorithms. It also supports Public Key Cryptographic Acceleration Unit (PKCAU) to ensure confidentiality and data integrity during wireless communication. The True Random Number Generator (TRNG) can provide unpredictable data for key generation across a variety of security protocols, further enhancing the system's security capabilities.　　The GD32VW553 series MCU Lineup　　Enabling wireless innovation with ecosystem　　The RISC-V development ecosystem for GD32 has become increasingly comprehensive, covering the entire development process. It is highly compatible with existing MCU development environments and user habits, enabling users to quickly build competitive market driven solutions. GigaDevice provides the new GD32VW553 series MCU with a range of free development tools, including GD32 IDE, GD-LINK debugging and download tool, and GD32 All-In-One Programmer. In addition, GigaDevice has concurrently released the SDKs that contain the underlying driver, wireless protocol stack, and application routine. Development boards that are compatible with various Real-Time Operating Systems (RTOS) supporting local connection, cloud connection, security, and Over the Air (OTA) upgrade are also available, enabling rapid deployment of connectivity devices. The GD32VW553 series meets the Matter over Wi-Fi application standard developed by the international organization Connectivity Standards Alliance (CSA). This allows GD32VW553 to facilitate seamless interconnections among various Matter devices, improving the overall compatibility and interoperability of smart home systems.　　SEGGER, the industry's leading supplier of embedded development systems from Germany, has formed a strategic partnership with GigaDevice to offer developers free access to the SEGGER Embedded Studio IDE and a complete suite of development tools. IAR from Sweden will also provide comprehensive support for the new GD32VW553 series MCU, including development and compilation tools as well as tracking and debugging tools.　　The GD32VW553 series MCU has achieved official Wi-Fi 6 certification from the Wi-Fi Alliance (WFA), Bluetooth certification from the Bluetooth Special Interest Group (Bluetooth SIG), and RF FCC/CE compliance certification. GigaDevice is actively partnering with multiple module manufacturers and developer platforms to offer "turnkey solutions," encompassing wireless modules, certificate authentication service, and more. These solutions enable the rapid development of Internet of Things (IoT) platforms and product solutions that support various wireless communication technologies such as Wi-Fi and Bluetooth.

Key word：

GigaDevice

Release time：2024-01-02 16:55 reading：2435 Continue reading>>

A World’s First: Murata Enables Better <span style='color:red'>Wi-Fi 6</span>E and Wi-Fi 7 Antenna Design with Cutting-Edge Parasitic Element Coupling Device

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A World’s First: Murata Enables Better Wi-Fi 6E and Wi-Fi 7 Antenna Design with Cutting-Edge Parasitic Element Coupling Device

　　Murata has announced its new Parasitic Element Coupling Device. This state-of-the-art solution improves antenna efficiency by magnetically coupling the parasitic element with the antenna and is the world's first solution designed for Wi-Fi 6E and Wi-Fi 7 products. For designers of smartphones, tablets, network routers, game consoles, and other compact electronics, it enables them to build more efficient antennas – a key requirement for many modern space-constrained devices.　　To develop products conforming to Wi-Fi 6E and Wi-Fi 7 standards, which utilize high-speed wireless communication, multiple high-performance antennas must be installed in electronic devices to improve communication speed and quality.　　However, as the dimensions of heatsinks and batteries expand, as processors become more advanced, the available space for mounting antennas tends to decrease.　　Consequently, there is a need for smaller antennas. But there is a technical limitation, in that the efficiency of wide-band antennas decreases when they are miniaturized. Therefore, designers need a solution that achieves both miniaturization and high performance.　　Murata’s solution is a parasitic element coupling device, made with its multilayer technology as a four-terminal surface-mount component of just 1.0 x 0.5 x 0.35mm.　　Murata’s parasitic element coupling device connects the feeding antenna* to its parasitic elements more effectively than is possible through free space. It acts as a tiny coupling device whose compact size enables strong coupling performance without the use of magnetic materials, which would be inappropriate at the targeted operating frequencies. One side of the coupling device is connected, at very low insertion loss, between a device’s RF circuitry and its main antenna. The other side is connected between the ground and the parasitic element. The resultant, more direct coupling enables the resonance characteristics of the parasitic element to be added to those of the feeding antenna. As a result, it enables more efficient operation across a broader frequency range or on multiple discrete bands.　　The device helps to combat that when an antenna is made smaller, the coupling between it and the parasitic elements is reduced, while the coupling between the parasitic elements and the ground is increased. By sustaining the coupling between the feeding antenna and parasitic element, parasitic element coupling device enables designers to use miniaturized antenna design methods without impacting the communication band of efficiency.　　The feeding antenna can cause an impedance mismatch when used over a wide band, leading to a degradation in wireless performance. In addition, when an antenna with a mismatched impedance is connected to a communication circuit using a long cable, the long cable can promote the impedance mismatch, causing larger insertion loss than expected and significantly reducing wireless communication performance. By using the device, you can improve antenna matching and reduce performance degradation in wireless communications even when using long cables.

Key word：

Murata

Release time：2023-12-13 14:15 reading：2285 Continue reading>>

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Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations

　　Murata, an industry leading electronics manufacturer, has further expanded its range of state-of-the-art wireless communication modules. The new LBEE5XV2EA (Type 2EA) module utilises Infineon’s CYW55573 system-on-chip (SoC), providing Bluetooth® 5.3 and triband Wi-FiTM operation – which includes both 2.4GHz and 5GHz bands as well as 6GHz band, Wi-Fi 6E, support.　　With many areas of the RF spectrum becoming increasingly overcrowded, Wi-Fi communication speeds can often suffer. The latest Wi-Fi 6E standard allows the same 9.6Gbps data rate as 5GHz Wi-Fi 6, but overall performance is more consistent thanks to less congestion and interference at 6GHz frequencies. Furthermore, Wi-Fi 6E provides additional (and wider) broadcast radio channels, which helps to increase data throughput in high-traffic areas.　　The module supports Wi-Fi 6’s target wake time (TWT) feature. This ensures that the device spends more time in standby mode, only communicating when necessary to reduce overall energy consumption and optimise network efficiency.　　The Type 2EA is equipped with on-board Bluetooth 5.3 functionality, including Bluetooth LE (low energy) Audio. This standard employs a new audio codec known as low complexity communications codec (LC3), which provides enhanced high-quality audio at a lower power requirement than Bluetooth Classic.　　20/40/80MHz channels are all incorporated into the module, with 1024-QAM modulation and a 2x2 MIMO antenna arrangement, helping to achieve heightened levels of data throughput. The Type 2EA’s wireless specification meets the latest IoT demands, making it ideal for low-latency communication applications such as video streaming, conference systems, virtual reality (VR) and augmented reality (AR) equipment, surveillance camaras, high resolution digital still camara, and alarm systems.　　Compared to other Wi-Fi 6E solutions available on the market, the Type 2EA has a better optimised design, thanks to utilising Murata’s high-performance components and miniaturisation expertise. With its surface mount device (SMD) design and compact size of just 12.5mm x 9.4mm x 1.2mm, the wireless module allows for easy system integration.　　While FCC certification is in preparation, the availability of ISED and MIC certification, along with conductive tests for CE, also helps to simplify any compliance process. This means that fewer engineering resources need to be committed, delivering both time and cost savings.

Key word：

Murata

Release time：2023-09-12 10:20 reading：2527 Continue reading>>

Nordic Launches <span style='color:red'>Wi-Fi 6</span> Companion IC and Dev Kit

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Nordic Launches Wi-Fi 6 Companion IC and Dev Kit

　　Nordic Semiconductor has launched the nRF7002 Wi-Fi 6 companion IC and its associated nRF7002 Development Kit (DK). The nRF7002 is the first in Nordic’s Wi-Fi product family and is a low power Wi-Fi 6 companion IC providing seamless dual band (2.4GHz and 5GHz) connectivity. It can be used together with Nordic’s nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs) and the nRF9160 cellular IoT (LTE-M/NB-IoT) System-in-Package (SiP), but can equally be used in conjunction with non-Nordic host devices. The DK makes it easy for developers to get started on nRF7002-based IoT projects.　　Wi-Fi 6 brings significant benefits to IoT applications—such as smart-home products, industrial sensors, asset trackers, and wearables—including power efficiency gains for battery powered Wi-Fi operation, and management of large IoT networks comprising hundreds of devices.　　“The nRF7002 Wi-Fi 6 companion IC is a testament to Nordic Semiconductor’s leadership in low-power wireless technology,” said Svein-Egil Nielsen, CTO/EVP of R&D and Strategy at Nordic. “This highly integrated and flexible solution will empower developers to create new, innovative Wi-Fi 6-enabled products. Supported with the nRF7002 DK and the award-winning nRF Connect SDK, combined with Nordic’s best in class technical support, I believe it has never been easier to develop great Wi-Fi products.”　　“The nRF7002 is designed to work alongside Nordic’s nRF52 and nRF53 Series making it a perfect fit for Matter, a smart-home standard backed by Amazon, Apple, Google, Nordic, Samsung, and hundreds of other companies,” said Finn Boetius, Product Marketing Engineer with Nordic. “The introduction of the IC and the nRF7002 DK now makes it easy for developers to get started on Matter and any other Wi-Fi based applications.” Matter uses Thread and Wi-Fi for data transport, and Bluetooth LE for commissioning.　　The nRF7002 brings low power and secure Wi-Fi to the IoT. The dual-band IC complies with Station (STA), Soft Access Point (AP), and Wi-Fi Direct operation, and meets the IEEE 802.11b, a, g, n (Wi-Fi 4), ac (Wi-Fi 5), and ax (Wi-Fi 6) Wi-Fi standards. The product also offers excellent coexistence with Bluetooth LE, Thread, and Zigbee. The nRF7002 supports Target Wake Time (TWT) a key Wi-Fi 6 power saving feature. Interfacing with a host processor is done via Serial Peripheral Interface (SPI) or Quad SPI (QSPI). The IC offers a single spatial stream, 20 MHz channel bandwidth, 64 QAM (MCS7), OFDMA, up to 86 Mbps PHY throughput, and BSS coloring.　　In addition to its suitability for general IoT applications and Matter, the nRF7002 is the ideal choice for implementing low power SSID-based Wi-Fi locationing when used together with Nordic’s nRF9160 SiP and the company’s nRF Cloud Location Services. SSID-based Wi-Fi locationing supplements GNSS- or cell-based locationing by providing accurate positioning indoors and in places with a high density of Wi-Fi access points.　　The introduction of the nRF7002 is accompanied by the launch of the nRF7002 DK, a development kit for the Wi-Fi 6 companion IC. The DK includes an nRF7002 IC and features an nRF5340 multiprotocol SoC as a host processor for the nRF7002. The nRF5340 embeds a 128 MHz Arm Cortex-M33 application processor and a 64 MHz high efficiency network processor. The DK supports the development of low-power Wi-Fi applications and enables Wi-Fi 6 features like OFDMA, Beamforming, and TWT. The DK includes: Arduino connectors; two programmable buttons; a Wi-Fi dual-band antenna and a Bluetooth LE antenna, and current measurement pins.　　Together with the DK, developing nRF7002-based designs is made simpler by the support for the IC in the nRF Connect SDK, Nordic’s scalable and unified software development kit for building products based on the company’s wireless devices. With the nRF7002 IC, nRF7002 DK, and nRF Connect SDK, developers can quickly and easily add Wi-Fi connectivity to their products, allowing them to connect to the Internet and communicate with other devices over a Wi-Fi network. Example applications for the nRF7002 DK are included with nRF Connect SDK.

Key word：

Nordic,Wi-Fi,nRF7002

Release time：2023-02-09 15:39 reading：3085 Continue reading>>

MediaTek Launches Newest Combo Chip with <span style='color:red'>Wi-Fi 6</span> and AP+Bluetooth

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MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth

MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.MediaTek’s Wi-Fi 6 chips support 2x2 and 4x4 which comply with the most updated standards. The Wi-Fi 6 chip also has a flexible architecture to support updated features when the Wi-Fi 6 specification is finalized later in 2019.“Consumers rely on our high performance connectivity portfolio to power their favorite intelligent devices, and now with support for next generation Wi-Fi 6 we deliver an even more, robust and seamless connectivity experience,” said Jerry Yu General Manager of MediaTek’s Intelligent Devices business unit. “We will continue to innovate and bring the most advanced technology and standards to consumer and enterprise markets.” MediaTek currently holds market-leading positions in powering TVs, streaming devices, smart speakers, voice assistant devices and tablets.MediaTek also brings unique built-in solutions to its chipset along with meeting the newest Wi-Fi standard to improve the end-users experience. MediaTek connectivity technology, empowered with OFDMA, 1024QAM solves data traffic conflicts. It reschedules multi-user’s packets and provides a higher internet data rate so there is no lag while playing on-line games or streaming video.It also delivers better concurrent performance between Wi-Fi and Bluetooth with the latest Wi-Fi 6 access point + Bluetooth combo chip to guarantee spectrum efficiency when two radios work simultaneously.MediaTek also supports and is leading the deployment of the Wi-Fi Alliance EasyMesh standard for extended Wi-Fi coverage. MediaTek’s family of smart home chipsets will be EasyMesh compatible. The new standard extends the Wi-Fi signal for total access in the home or even into the backyard.

Key word：

MediaTek

Release time：2019-01-11 00:00 reading：1166 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments

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